Digital Food Processing Initiative supports innovation

Personalised food, vegetable proteins with the bite of meat or production on demand; digitally controlled food production enables innovations which were inconceivable until very recently. From 29 June, businesses can address all their questions about digital technology to the Digital Food Processing Initiative (DFPI), a cooperative venture between Wageningen University & Research, TNO, AMSYSTEMS Center and Eindhoven University of Technology.

The launch of the Digital Food Processing Initiative will take place on 29 June during the 3D Food Printing Experience at the Wageningen campus. “We provide companies with insight into the possibilities and support them with knowledge about food and high-tech systems,” says Ben Langelaan, research manager Food Technology in Wageningen UR and member of the DFPI steering group. “This helps them more easily translate ideas to the market.’

Innoveren met het Digital Food Processing Initiative

The ambition of the DFPI is to be the global consortium for digitally controlled food production. “Our combined expertise of food and digital technology is unique, which is why we can really help companies move forward,” adds Pieter Debrauwer, research manager at TNO/AMSYSTEMS Center and member of the DFPI steering group. “Sometimes it may be necessary to change the recipe in order to create an attractive product, while at other times the equipment needs adapting in order to realise the right process conditions.”

More than 3D printing

DFPI focuses on five innovation themes: sustainability, personalised food, on-demand food production, new forms and flavours, and new social experiences. While the main food applications to date have been related to 3D printing – such as new shapes of pasta – both organisations expect digital techniques to have a much larger social impact.

On-demand production, for example, could lead to less food waste, while personalised food can help produce special high-protein products for the elderly or athletes. 3D printing can change the functionality of food via the development of new structures, textures and flavours, which could have potential for people who have difficulty swallowing. Digital techniques are expected to drastically change the production, location and logistics of food production.

Introduction

Food producers, ingredient suppliers, machinery manufacturers, caterers, retailers and other interested parties can have a first look on 29 June at the options for digital food processing. The introduction will include various demonstrations of 3D food printing and presentations on the successful application of digital techniques in the food industry. Professor Arthur Mol, Rector Magnificus and vice-president of the WUR Executive Board, will officially launch the DFPI at 11.30. Learn more about the programme and register at the event page for the 3D Food Printing Experience.

Initiators

DFPI is a joint initiative of Wageningen Food & Biobased Research, the Wageningen chair groups Food Process Engineering and Physics and Physical Chemistry of Foods, and AMSYSTEMS Center, a partnership between TNO Equipment for Additive Manufacturing and TU Eindhoven High Tech Systems Center.


Board meeting Fieldlab MultiM-3D at Océ

On June 12th the second Board meeting of the Fieldlab MultiM-3D was held, kindly hosted by Océ in Venlo, in presence of all work package leaders and management.

Being on an actual partner location, we could get to know the companies at their own facilities which was a very effective way to learn the needs and skills.

Update future planning
The program started with a tour through Océ printing facilities where we could see the life material jetting as part of the dental work package. Also Océ testability, PAINT, was demonstrated. PAINT makes it possible to monitor during printing and to assure reliable jetting of all nozzles. After that, the work package leaders provided an update of their work package with an emphasis on the near and further future planning of their activities. It was nice to see that while running in the second half of the project period, actual and appealing demonstrators are being produced by all work packages. It demonstrates that after getting to know the partners, we are now speeding up in progressing of the technical work.

Also it is noteworthy to mention that there is a clear wish to continue the activities of the fieldlab in the future as part of H2020, EFRO or other means. This will be considered further and possibilities are being assessed. The next general stakeholder meeting is planned for the last week of September, venue is still open! Thanks Océ for hosting us!

The Fieldlab MultiM-3D on tour at Océ in Venlo


3D Food Printing Experience – 29 June

How to meet the demands of more food in the near future?

Join the ‘3D Food Printing Experience’ on June 29 at Wageningen University & Research. And learn more about various 3D printing technologies and state-of-the-art 3D printing equipment.

Click here for the full program and free registration.

The ‘3D Food Printing Experience’ is a collaboration of WUR and AMSYSTEMS Center.

 


Succesfull AMSYSTEMS Center Innovation Day

 

Last Thursday, 30 May 2018, the AMSYSTEMS Center Innovation Day took place at De Gele Kegels, Eindhoven.

This day AMSYSTEMS Center had a rich and varied program. The program consist of interesting talks from international speakers from different industries, such as aerospace, software, pharmaceutical and mechatronics industry. Our innovations in High Tech applications, Printed Electronics, Food and Pharma were shown at our tech market and at our lab facilities. This day our partners, among them also the Fieldlab MultiM-3D partners, and participants shared their developments and view on additive manufacturing. Thanks to them we look back at a successful and varied day.


Fieldlab MultiM3D works on highly promising solution for billion euro market

A collaboration of AMSYSTEMS Center, Brightlands Material Center, NextDent and Océ on 3D printed dentures within the Fieldlab Multi-Material 3D.

Read here the article.

 

Source: Link Magazine


Hyb-Man to transform production of smart electronic systems using 3D manufacturing methods

Paris, 5 April 2018 – The EUREKA PENTA funding program, managed by AENEAS, today highlights the Hyb-Man project. The Hyb-Man (Hybrid 3D Manufacturing of Smart Systems) project is developing additive manufacturing methods (also known as 3D printing) to enable flexible, first-time-right production of smart systems for lighting and automotive applications.

AMSYSTEMS Center (TNO and TU/e HTSC) is one of the partners of this project consortium. Read more…


AMSYSTEMS Center in Tokyo

On February 12th-16th AMSYSTEMS Center, a collaboration of TU/e High Tech Systems Center and TNO, is joining a trade mission from NanoNextNL to Japan. AMSYSTEMS Center has planned several visits to companies. This mission will be combined with NanoTech Tokyo 2018 (14th -16th February). Together with HOLST Centre AMSYSTEMS will welcome relations and visitors in the Holland Pavillion, Booth 5X-13.

Holland High Tech pavilion Nano Tech Expo 2017 (Source www.nanonextnl.nl)


AMSYSTEMS Center is making progress

The founders of the center Erwin Meinders (TNO) and Katja Pahnke (TU/e High Tech Systems Center) in latest the newsletter of Mechatronica & Machinebouw.

Click here for the article: Amsystems komt op stoom – Mechatronica&Machinebouw (Dutch).


Holst Centre and AMSYSTEMS Center showcase latest developments in flexible & printed electronics at IDTechEx show! USA

Eindhoven (NL) / Santa Clara (CA, USA), November 14th, 2017 – On November 15-16, 2017, Holst Centre, an open innovation initiative of imec and TNO, and AMSYSTEMS Center, a joint innovation center of TNO and the High Tech Systems Center of Eindhoven University of Technology, will demonstrate the latest developments in printed and flexible electronics at the IDTechEx Show! at the Santa Clara Convention Center in California, USA.  

Holst Centre is at the forefront of the development of flexible, printed electronics, that can be embedded directly into fabrics, plastics and construction materials to create systems that conform to our bodies, the surroundings of our daily life including consumer products, interiors and transport vehicles.

One of the topics Holst Centre focusses on is in-mold electronics (IME) with complex 3D shapes by thermoforming or injection molding processes. By combining printed electronics with dedicated materials, designs and components, and carefully tuning thermal and pressure stability, Holst Centre is able to produce so called smart skins. Senior Scientist Dr Margreet de Kok will explain more about this technology, specifically focused on Automotive applications, in her lecture at the IDTechEx Show! on November 15th.

The AMSYSTEMS Center is dedicated to developing next generation additive manufacturing  production equipment for smart, personalized and multi-functional products. The AMSYSTEMS Center targets high-tech applications, 3D printed electronic devices, and 3D printed food and healthcare applications, with spin-off to other markets that require personalized, on-demand manufacturing.

Dr Joris Remmers, Associate Professor Composite Materials at the Eindhoven University of Technology and connected to the AMSYSTEMS Center, is scheduled to present at the show on November 16th. In his lecture, titled: ‘Towards, First Time Right Production of Multi-Material 3D Printed Products’, he will focus on the unravelling of the micro-mechanical behavior of printed materials and their interfaces as a function of the printing conditions.

For abstracts, timing and registration for both lectures please consult the dedicated IDTechEx website.

Various functional demonstrators of AMSYSTEMS Center and Holst Centre’s cutting edge technologies, as well as a BigRep Studio 3D printing unit, will be on display at the joint booth (M24) at the IDTechEx Show! at the Santa Clara Convention Center in California, USA.


Holst Centre and AMSYSTEMS Center showcase latest developments in flexible & printed electronics at IDTechEx show! USA

Eindhoven (NL) / Santa Clara (CA, USA), November 14th, 2017 – On November 15-16, 2017, Holst Centre, an open innovation initiative of imec and TNO, and AMSYSTEMS Center, a joint innovation center of TNO and the High Tech Systems Center of Eindhoven University of Technology, will demonstrate the latest developments in printed and flexible electronics at the IDTechEx Show! at the Santa Clara Convention Center in California, USA.  

Holst Centre is at the forefront of the development of flexible, printed electronics, that can be embedded directly into fabrics, plastics and construction materials to create systems that conform to our bodies, the surroundings of our daily life including consumer products, interiors and transport vehicles.

One of the topics Holst Centre focusses on is in-mold electronics (IME) with complex 3D shapes by thermoforming or injection molding processes. By combining printed electronics with dedicated materials, designs and components, and carefully tuning thermal and pressure stability, Holst Centre is able to produce so called smart skins. Senior Scientist Dr Margreet de Kok will explain more about this technology, specifically focused on Automotive applications, in her lecture at the IDTechEx Show! on November 15th.

The AMSYSTEMS Center is dedicated to developing next generation additive manufacturing  production equipment for smart, personalized and multi-functional products. The AMSYSTEMS Center targets high-tech applications, 3D printed electronic devices, and 3D printed food and healthcare applications, with spin-off to other markets that require personalized, on-demand manufacturing.

Dr Joris Remmers, Associate Professor Composite Materials at the Eindhoven University of Technology and connected to the AMSYSTEMS Center, is scheduled to present at the show on November 16th. In his lecture, titled: ‘Towards, First Time Right Production of Multi-Material 3D Printed Products’, he will focus on the unravelling of the micro-mechanical behavior of printed materials and their interfaces as a function of the printing conditions.

For abstracts, timing and registration for both lectures please consult the dedicated IDTechEx website.

Various functional demonstrators of AMSYSTEMS Center and Holst Centre’s cutting edge technologies, as well as a BigRep Studio 3D printing unit, will be on display at the joint booth (M24) at the IDTechEx Show! at the Santa Clara Convention Center in California, USA.